You’re invited to attend a 30 minute webinar presented by Polymer Science, Inc.’s very own Eric Dumont on Thermal Gap Fillers during thermalLIVE 2018!

Eric’s background includes developing cooling/ventilation systems for telecommunication equipment and engineering PCBA level sub-assemblies while working as a thermal engineer at Nortel Networks in Ottawa, Canada.

Eric also managed the mechanical development and thermal engineering of indoor and outdoor equipment for companies such as Ericsson, Huawei and Alcatel during his time at Flextronics in Shanghai, China.

He is currently working with product designers in the San Francisco Bay Area supporting them with their material selection challenges.

You don’t want to miss this opportunity!

Click here to sign up now!